Industries To Exhibit Automated Wafer Handling For Thin Wafers At SemiconWest 2011
July 01, 2011 - Anaheim, CA -
CHAD Industries announced today that they will demonstrate the latest automated wafer
handling techniques for thin and non-standard wafers using electrostatic wafer carriers
during SemiconWest 2011 in San Francisco this month.
During the show CHAD Industries will be exhibiting with their technology partner,
Beam Services Inc. Together they will demonstrate how wafers that have typically been
considered “challenging to handle”, can now be mounted to an electrostatic carrier and
treated like a standard wafer during handling and wafer processing. The combined
CHAD/BEAM solution results in a robust tool that incorporates the wafers, carriers,
and the electrostatic chucking station within a single automated wafer handling workcell.
Challenging wafers include (but are not limited to) thin, LED, and substrate wafers.
This automated handling technique also allows wafers that are smaller than 200mm to be
processed using standard 200mm equipment.
CHAD will be exhibiting the WaferMate300-1™ workcell, configured
to handle 200mm wafers and running the latest WaferWare™ software.
This versatile 5th generation workcell uses proven handling techniques to automate standard,
and non-standard, wafers for numerous OEM equipment manufacturers.
Beam Services will be exhibiting the APACHE™ table-top electrostatic
chucking station, and current generation of electrostatic carriers. The patented
electrostatic carriers have been redesigned to provide reliable and durable wafer bonding
results during wafer processing. Carriers can be manufactured to mount any type of wafer,
and to meet numerous wafer processing requirements.
“We are very excited to partner with Beam Services, and to be able to integrate their
technology within our wafer handling equipment.” Says Scott Klimczak (President of CHAD Industries).
“This partnership offers a vertically integrated solution for both CHAD and BEAM, and allows
each company to leverage its individual strengths.”
“We believe that this technology will allow wafers that were previously considered too fragile,
too difficult to handle, or simply unsuitable for automation, to be easily processed using
standard equipment.” says Chip Mascal, VP Sales and Marketing for Beam Services. “This opens up
tremendous opportunities for customers looking to improve manufacturing efficiencies and capabilities.”
CHAD Industries and BEAM Services will be located in booth #5377 in the North Hall during the
Semicon-West show. The show will run from July 12-14 in San Francisco at the Moscone Center.
Learn more at www.chadindustries.net, or call Rich Munro at CHAD Industries 714 938-0080
and find your solution.
About CHAD Industries:
CHAD Industries designs, manufactures and markets odd-form electronics assembly equipment,
automated solar cell manufacturing systems, and semiconductor wafer handling solutions.
CHAD is privately owned and has been in the automation business since 1973.
About Beam Services, Inc.:
Beam Services is an International distributor and service provider of semiconductor
manufacturing capital equipment. Most recently Beam Services has acquired the
intellectual property rights to develop and manufacture mobile electrostatic temporary
bond technology solutions under the division of BSI Engineering.