Press Releases

Chad Industries Announces Dage Design Win for the WaferMate™ Product Line

WaferMate300™ Wafer Handling System is Selected by Leading Bond Test and X-Ray Tool Company.

October '07, ANAHEIM, CA -Chad Industries, Inc., a leading supplier of factory automation solutions for the semiconductor, electronics, and life sciences industries announced today that it has been qualified by Dage, A Nordson Company, as an EFEM (Equipment Front-End Module) supplier. Dage needed an Automated Wafer Handling System seamlessly integrated to their Dage 4300 Wafer Bump Test System, and a Company who had proven reliable designs with the ability to support the tool in the field.

To protect the IN-Process Wafers, the customer mandated that all 300mm wafers would be transported throughout the fab in industry standard FOUP’s (Front Opening Unified Pods). This required that the Automated Wafer Handler integrated with the Dage 4300 Bump Test System would have an industry standard FOUP load port. The additional challenge would be to fully integrate the Automated Wafer Handler with the Dage 4300 Bump Test System without Dage code changes and within the timeframe required for delivery to the end user. The Dage/Chad Tool would need to be seamlessly integrated so that fab operation was not interrupted and familiarity with the Dage tool operation would not be compromised.

The Benefits to an Automated Wafer Handling System integrated with the Dage Bondtester:

  • Elimination of manual handling of expensive wafers
  • Improved cleanliness through isolation of bond tester and wafer handler
  • Increased productivity through semi-automated testing

CHAD was able to cleanly and seamlessly integrate the WaferMate 300/1 automated wafer handling tool to the Dage 4300. The ability to easily adapt automation to the Dage 4300 without serious modification to Dage’s software or hardware made the project a great success. CHAD continued to work with Dage’s customer to ensure a successful installation and continued followed up to enhance tool operation.

“We are pleased that Dage used CHAD for their automated wafer handling needs. The WaferMate™ proved again that the design is easily adaptable to most industrial process tools with great success,” said Scott Klimczak, president of Chad Industries. “Reducing the risk and providing engineer expertise in the handling of standard and non-standard wafers affords our customers a partner that will allow them to focus on their core skills.”

Chad Industries designs, manufactures and markets automated wafer handling solutions and is the leading manufacturer of non-standard wafer handling solutions to the semiconductor industry. More information is available at http://www.chadindustries.net.

For more information on this or any of CHAD's assembly solutions, please contact us at 1565 S. Sinclair Street, Anaheim, CA 92806, USA Tel (714) 938-0080 or Fax (714) 938-0630.

The Semiconductor Division of Dage (A Nordson Company) develops and manufactures world-leading Bond test and digital X-Ray inspection systems.

For more information on the Dage 4300, please contact Dage at Rabans Lane, Aylesbury, Buckinghamshire, HP19 8RG, TEL+44 (0) 1296-317800, FAX +44 (0) 1296 435408

More information is available at http://www.dage-group.com

 
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