Chad
Industries Announces Dage Design Win for the WaferMate™ Product
Line
WaferMate300™ Wafer
Handling System is Selected by Leading Bond Test and X-Ray
Tool Company.
October
'07, ANAHEIM, CA -Chad Industries, Inc., a leading
supplier of factory automation solutions for the semiconductor,
electronics, and life sciences industries announced today
that it has been qualified by Dage, A Nordson Company,
as an EFEM (Equipment Front-End Module) supplier. Dage
needed an Automated Wafer Handling System seamlessly integrated
to their Dage 4300 Wafer Bump Test System, and a Company
who had proven reliable designs with the ability to support
the tool in the field.
To protect the IN-Process Wafers, the customer mandated
that all 300mm wafers would be transported throughout
the fab in industry standard FOUP’s (Front Opening Unified
Pods). This required that the Automated Wafer Handler integrated
with the Dage 4300 Bump Test System would have an industry
standard FOUP load port. The additional challenge would
be to fully integrate the Automated Wafer Handler with
the Dage 4300 Bump Test System without Dage code changes
and within the timeframe required for delivery to the end
user. The Dage/Chad Tool would need to be seamlessly integrated
so that fab operation was not interrupted and familiarity
with the Dage tool operation would not be compromised.
The Benefits to an Automated Wafer Handling System integrated
with the Dage Bondtester:
- Elimination
of manual handling of expensive wafers
- Improved cleanliness through isolation of bond tester and wafer
handler
- Increased productivity through semi-automated testing
CHAD
was able to cleanly and seamlessly integrate the WaferMate
300/1 automated wafer handling tool to the Dage
4300. The ability to easily adapt automation to the Dage 4300
without serious modification to Dage’s software or hardware
made the project a great success. CHAD continued to work with
Dage’s customer to ensure a successful installation and
continued followed up to enhance tool operation.
“We
are pleased that Dage used CHAD for their automated wafer
handling needs. The WaferMate™ proved again
that the design is easily adaptable to most industrial
process tools
with great success,” said Scott Klimczak,
president of Chad Industries. “Reducing the
risk and providing engineer expertise in the handling
of standard and non-standard wafers
affords our customers a partner that will allow
them to focus on their core skills.”
Chad Industries designs, manufactures and markets
automated wafer handling solutions and is the
leading manufacturer
of non-standard wafer handling solutions to the
semiconductor industry. More information is available
at http://www.chadindustries.net.
For more information on this or any of CHAD's
assembly solutions, please contact us at 1565
S. Sinclair
Street, Anaheim, CA
92806, USA Tel (714) 938-0080 or Fax (714)
938-0630.
The Semiconductor Division of Dage (A Nordson
Company) develops and manufactures world-leading
Bond test
and digital X-Ray
inspection systems.
For more information on the Dage 4300, please
contact Dage at Rabans Lane, Aylesbury,
Buckinghamshire, HP19 8RG, TEL+44
(0) 1296-317800, FAX +44 (0) 1296 435408
More information is available at http://www.dage-group.com
