200mm Wafer Handling System

The WaferMate200™ is a high performance robotic wafer-handling platform engineered for expert automation of semiconductor wafers and similar substrates.

The WaferMate200™ is the simplest, most cost effective path for wafer-level process tool manufacturers to deliver automated solutions to the end user.

Screen printers, bonders, dispensers, inspection and plasma systems that traditionally fit a conveyor layout, mate right up to the handler and the standard SMEMA interface.

CHAD’s systems are made highly effective with WaferWare™, a third-generation, flexible software suite that supports wide-ranging application and GUI control.

The WaferMate200™ is configurable in width for two, three or four 200mm cassettes positions. This region also accommodates film frames, 300mm open cassettes, and special thin and warped wafer components.

Image of CHAD WaferMate200, 200 mm  and 300 mm  Automated Wafer Handling System

 

Image of Custom Configurations of the WaferMate200, 200mm and 300mm  Automated Wafer Handling System

 

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