300mm Wafer Handling System

The WaferMate300™ is a highly configurable, BOLTS-compatible robotic wafer-handling cell that mates high performance with cost competitiveness.

The WaferMate300™ pairs expertly with all types of process tools and environments.
For BEOL such as wafer level packaging, the WaferMate300™ is configured with side handoff for traditional conveyor-style layouts such as screen printers, bonders, dispensers, inspection and plasma tools. CHAD’s systems are often paired with more than one tool.

As a class-1 clean FEOL EFEM, the WaferMate300™ includes all applicable mini-environment components, E84 compliance, and rear hand-off.

CHAD’s systems are made highly effective with WaferWare™, a third-generation, flexible software suite that allows wide-ranging application and GUI control.

The WaferMate300™ is a 300mm automation platform that can be adapted for 200mm and smaller substrates with the addition of CHAD’s cassette shelf module, CHAD’s SMIF-EZ™ pod opener for SMIF environments, or FOUP bridge tools.

Image of CHAD WaferMate300 - 300mm Wafer Handling System

Image of Custom Configurations of WaferMate300, 300mm and 200mm Wafer Handling Systems  
PDF of CHAD WLM 300 mm wafer handler with load ports
Movie of CHAD 300 mm wafer handling system
 
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