Press Releases

Thin Wafer Capabilities from CHAD Industries and DEK Printing Machines

June '09, ANAHEIM, CA - CHAD Industries has announced that it will be demonstrating CHAD’s thin wafer handling capabilities at this year’s SEMICON West show. Exhibiting with CHAD Industries in a joint booth will be one of CHAD’s key OEM customers, DEK Printing Machines. On exhibit will be CHAD’s WaferMate200 wafer handler integrated with DEK’s Galaxy screen printer to hand off thin wafers. Each system will be tooled to handle 200mm wafers that are 125u” thick. Additional wafer handling capabilities can be deployed for wafers as thin as 75u”.

CHAD Industries will also be displaying the WaferMate300-1 workcell equipped for 300mm wafers, the SMIF-EZ loadport for 200mm wafers presented in SMIF’s, and CHAD’s new open architecture PC based control system.

“We are excited to partner with DEK Printing Machines, one of our oldest OEM customers, and to help showcase DEK’s new thin wafer capabilities. Our engineering teams worked together to conceive and design a solid, reliable solution for thin wafer handling,” said Scott Klimczak, President of CHAD Industries. “This is just another example of how in these challenging times, we find that our OEM customers are increasingly dependant upon CHAD Industries to provide engineering support and solutions to their wafer handling requirements. Recent downsizing has put more emphasis on outsourcing, and CHAD is well positioned to provide comprehensive engineering support to solve these new customer challenges.”

CHAD and DEK will be located at booth #811 in the South Hall of San Francisco’s Moscone Center during SEMICON West, taking place from July 14th to July 16th. Visitors are invited to visit the booth to find out more about DEK’s thin wafer printing process, and to learn how CHAD can apply its extensive experience and knowledge to solve their wafer handling challenges.

About CHAD Industries

CHAD Industries is a pioneer in the area of wafer and substrate handling for WLP (Wafer Level Packaging) applications. Working closely with its customers, CHAD has developed solutions for handling a variety of substrates, from 50mm to 300mm diameter wafers; warped, thin and glass wafers as well as wafers mounted on film frame. CHAD provides cost-effective solutions by utilizing standard robotic platforms and designing in special end-effectors, wafer aligners, cassette tilters, and other custom elements to meet the exact requirements of the specific application. For more information, visit CHAD at

About DEK Printing Machines

DEK Printing Machines is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at

For more information, contact:
CHAD Industries
Richard Munro, Semiconductor Sales Manager
714-938-0080 ext. 224

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