WaferMate200™ is a high performance robotic wafer-handling
platform engineered for expert automation of semiconductor wafers
and similar substrates.
The WaferMate200™ is
the simplest, most cost effective path for wafer-level process
tool manufacturers to deliver automated solutions
to the end user.
Screen printers, bonders, dispensers, inspection and plasma systems
that traditionally fit a conveyor layout, mate right up to the handler
and the standard SMEMA interface.
CHAD’s systems are made highly effective with WaferWare™,
a third-generation, flexible software suite that supports wide-ranging
application and GUI control.
The WaferMate200™ is configurable in width
for two, three or four 200mm cassettes positions. This region also
accommodates film frames, 300mm open cassettes, and special thin
and warped wafer components.