WaferMate300™ is a highly configurable, BOLTS-compatible
robotic wafer-handling cell that mates high performance with
expertly with all types of process tools and environments.
For BEOL such as wafer level packaging, the WaferMate300™ is
configured with side handoff for traditional conveyor-style layouts
such as screen printers, bonders, dispensers, inspection and plasma
tools. CHAD’s systems are often paired with more than one tool.
a class-1 clean FEOL EFEM, the WaferMate300™ includes
all applicable mini-environment components, E84 compliance, and rear
CHAD’s systems are made highly effective with WaferWare™,
a third-generation, flexible software suite that allows wide-ranging
application and GUI control.
WaferMate300™ is a 300mm automation platform that can
be adapted for 200mm and smaller substrates with the addition of
CHAD’s cassette shelf module, CHAD’s SMIF-EZ™ pod
opener for SMIF environments, or FOUP bridge tools.