Industries is a pioneer in the area of wafer and substrate
handling for WLP (Wafer Level Packaging) applications.
Working closely with its customers, CHAD has developed solutions
for handling a variety of substrates, from 50mm to 300mm diameter
wafers; warped, thin and glass wafers as well as wafers mounted
on film frame. CHAD provides cost-effective solutions by utilizing
robotic platforms and then designing in special end-effectors, wafer
aligners, cassette tilters, and other custom elements to meet the
exact requirements of the specific application.
To provide the best solution possible, CHAD leverages its extensive
experience in the integration of all types of robots, (i.e. SCARA,
linear axis, 6-axis, etc.) controllers, and vision systems from companies
such as Adept, Panasonic, Newport, Yaskawa, and Cognex. When needed,
CHAD has also designed custom robots to address specific customer
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